Application: Medical Equipment Optical Platform
• Plane degree after adsorption silicon wafers ≤5um
• Heating time: 20 ℃ to 55 ℃ time ≤30s
• Treatment time: 55 ℃ to 20 ℃ time ≤ 55s
• Digital pressure gauge reading after adsorbing chip rising cooling process <-85kPa
• Digital pressure gauge readings of unsustainable chip> -10kPa
